The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD
- Chi-Chun Liu
- Yann Mignot
- et al.
- 2018
- SPIE Advanced Lithography 2018
Conference paper
Nelson Felix
Title
Director, Technical Business Development - IBM Semiconductors
Bio
Nelson Felix joined IBM in 2008 and is currently Director of Strategy and Business Development for IBM Semiconductor Research in Albany, NY. Previous to this role, Nelson held multiple management and executive positions in process research, focused on logic patterning, process, and metrology innovations supporting IBM’s leading-edge CMOS device and AI hardware roadmap. Nelson received his B.S. from the University of Massachusetts, Amherst (2002) and his Ph.D. from Cornell University (2007), both in chemical engineering, and his doctoral work centered on the characterization of novel photoresist materials for EUV. Dr. Felix is an SPIE Fellow, and he is co-inventor on over 50 patents and co-author on over 100 publications.
Publications
Self-aligned blocking integration demonstration for critical sub-30nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2018
- SPIE Advanced Lithography 2018
Conference paperInorganic hardmask development for EUV patterning
- Anuja De Silva
- A. Dutta
- et al.
- 2018
- SPIE Advanced Lithography 2018
Conference paperPolymer brush as adhesion promoter for EUV patterning
- Jing Guo
- Anuja De Silva
- et al.
- 2018
- SPIE Advanced Lithography 2018
Conference paperDefect detection strategies and process partitioning for SE EUV patterning
- Luciana Meli
- Karen Petrillo
- et al.
- 2018
- SPIE Advanced Lithography 2018
Conference paperDetection of Printable EUV Mask Absorber Defects and Defect Adders by Full Chip Optical Inspection of EUV Patterned Wafers
- Luciana Meli
- Ravi Bonam
- et al.
- 2017
- IEEE Trans Semicond Manuf
PaperDevelopment of amorphous silicon based EUV hardmasks through physical vapor deposition
- Anuja De Silva
- Yann Mignot
- et al.
- 2017
- SPIE Photomask Technology + EUV Lithography 2017
Conference paperCoater/developer based techniques to improve high-resolution EUV patterning defectivity
- Koichi Hontake
- Lior Huli
- et al.
- 2017
- SPIE Photomask Technology + EUV Lithography 2017
Conference paperStacked nanosheet gate-all-around transistor to enable scaling beyond FinFET
- N. Loubet
- T.B. Hook
- et al.
- 2017
- VLSI Technology 2017
Conference paperUltrathin extreme ultraviolet patterning stack using polymer brush as an adhesion promotion layer
- Indira Seshadri
- Anuja De Silva
- et al.
- 2017
- J. Micro/Nanolithogr. MEMS MOEMS
Paper
Patents
- US
- 12310100
- US
- 12261044
- US
- 12021135
- US
- 12019376
- CN
- ZL 2018 8 0081456.1
- US
- 11804401
- US
- 11699592
- US
- 11695059
- US
- 11682558
- US
- 11681213
Blog posts
IBM and Albany partners unlock new yield benchmarks for EUV patterning
Technical noteLuciana Meli and Nelson FelixEUV patterning yield breakthrough sets new benchmark for logic scaling
Technical noteNelson Felix and Luciana Meli4 minute readIBM Research at SPIE 2020: New architectures and fabrications for AI hardware
ResearchNelson Felix4 minute read
Top collaborators
LM
Luciana Meli
Senior Manager: Patterning & Metrology
NL
Nicolas Loubet
STSM, Advanced Logic Technology Research
HB
Huiming Bu
Vice President: IBM Semiconductors Global R&D and Albany Operations
NL
Nick Lanzillo
Research Staff Member