Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
The Si-Ge interdiffusivity in epitaxial strained Si/Si1-yGey/strained Si/relaxed Si1-x0Gex0 and strained Si/relaxed Si 1-x0Gex0 heterostructures is investigated for Ge fractions between 0 and 0.56 over the temperature range of 770-920 °C. Si-Ge interdiffusivity is found to increase by 2.2× for every 10% increase in local Ge fraction for interdiffusion in strained Si/relaxed SiGe structures. Significantly enhanced Si-Ge interdiffusion is observed in structures with Si1-yGey layers under biaxial compressive strain. The interdiffusivity increases by 4.4× for every 0.42% increase in the magnitude of biaxial compressive strain. These results were incorporated into an interdiffusion model that successfully predicts the interdiffusion in epitaxial SiGe heterostructures. © 2007 IOP Publishing Ltd.
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
U. Wieser, U. Kunze, et al.
Physica E: Low-Dimensional Systems and Nanostructures
Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Robert W. Keyes
Physical Review B