Vacuum underfill technology for advanced packaging (IMPACT 2011)
- M. Hoshiyama
- M. Hasegawa
- et al.
- 2011
- IMPACT 2011
Conference paper
Publications
81 results for John Knickerbocker
An 8x10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2011
- VLSI Circuits 2011
Conference paperTechnologies for exascale systems
- Paul Coteus
- John Knickerbocker
- et al.
- 2011
- IBM J. Res. Dev
Paper3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- Joana Maria
- Bing Dang
- et al.
- 2011
- ECTC 2011
Conference paperVacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
Conference paperElectromagnetic-SPICE modeling and analysis of 3D power network
- Zheng Xu
- Jian-Qiang Lu
- et al.
- 2011
- ECTC 2011
Conference paperLow-profile 3D silicon-on-silicon multi-chip assembly
- Paul Andry
- Bing Dang
- et al.
- 2011
- ECTC 2011
Conference paperDevelopment of vacuum underfill technology for a 3D chip stack
- Katsuyuki Sakuma
- Sayuri Kohara
- et al.
- 2011
- JMM
PaperThree-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnects
- Bing Dang
- Michael Shapiro
- et al.
- 2010
- IEEE Electron Device Letters
PaperTerabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2010
- ECTC 2010
Conference paper