Growth of crystalline defects on the surface of FSG dielectrics
- J.P. Gambino
- J. Burnham
- et al.
- 2003
- AMC 2003
Conference paper
Publications
145 results for Lynne Gignac
A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
Conference paperReduced Cu interface diffusion by CoWP surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Microelectronic Engineering
Conference paperCorrelation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects
- L. Gignac
- C.-K. Hu
- et al.
- 2003
- Microelectronic Engineering
Conference paperDoes line edge roughness matter?: FEOL and BEOL perspectives
- Qinghuang Lin
- Chuck Black
- et al.
- 2003
- Microlithography 2003
Conference paperComparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters
PaperEffect of liner thickness on electromigration lifetime
- E. Liniger
- C.-K. Hu
- et al.
- 2003
- Journal of Applied Physics
PaperEvaluations and considerations for self-assembled monolayer field-effect transistors
- C.R. Kagan
- A. Afzali
- et al.
- 2002
- Nano Letters
PaperReduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters
PaperA comparison of grain size measurements in Al-Cu thin films: Imaging verses diffraction techniques
- Lynne Gignac
- C.E. Murray
- et al.
- 2002
- Microscopy and Microanalysis
Paper