Electrical performances and structural designs of copper bonding in wafer-level three-dimensional integration
- K.N. Chen
- A. Young
- et al.
- 2011
- Journal of Nanoscience and Nanotechnology
Paper
Publications
22 results for K.N. Chen
Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications
- K.N. Chen
- Cornelia Tsang
- et al.
- 2011
- Journal of Nanoscience and Nanotechnology
PaperCu-based bonding technology for 3D integration applications
- K.N. Chen
- Zheng Xu
- et al.
- 2012
- 3DIC 2012
Conference paperWafer-level self-aligned nano tubular structures and templates for device applications
- K.N. Chen
- J.C. Arnold
- 2010
- Journal of Nanoscience and Nanotechnology
PaperReliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding
- K.N. Chen
- T.M. Shaw
- et al.
- 2010
- IEDM 2010
Conference paperInvestigations of Cu bond structures and demonstration of a wafer-level 3D integration scheme with W TSVs
- K.N. Chen
- Cyril Cabral Jr.
- et al.
- 2010
- VLSI-TSA 2010
Conference paperInvestigation and effects of wafer bow in 3D integration bonding schemes
- K.N. Chen
- Y. Zhu
- et al.
- 2010
- Journal of Electronic Materials
PaperThe fabrication of a programmable via using phase-change material in CMOS-compatible technology
- Kuan-Neng Chen
- Lia Krusin-Elbaum
- 2010
- Nanotechnology
PaperReliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
- R.R. Yu
- F. Liu
- et al.
- 2009
- VLSI Technology 2009
Conference paperThermal stress effects of Ge2Sb2Te5 phase change material: Irreversible modification with Ti adhesion layers and segregation of Te
- K.N. Chen
- C. Cabral Jr.
- et al.
- 2008
- Microelectronic Engineering
Paper