A multilayer organic package with four integrated 60GHz antennas enabling broadside and end-fire radiation for portable communication devices
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2015
- ECTC 2015
Conference paper
Publications
Dual-side cooling for a three-dimensional (3D) chip stack : Additional cooling from the laminate (substrate) side
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2015
- ECTC 2015
Conference paperImproved connectorization of compliant polymer waveguide ribbon for silicon nanophotonics chip interfacing to optical fibers
- Yoichi Taira
- Hidetoshi Numata
- et al.
- 2015
- ECTC 2015
Conference paperDefect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers
- Vijay Sukumaran
- Thuy Tran-Quinn
- et al.
- 2015
- ECTC 2015
Conference paperSemiconductor optical amplifier (SOA) packaging for scalable and gain-integrated silicon photonic switching platforms
- Russell A. Budd
- Laurent Schares
- et al.
- 2015
- ECTC 2015
Conference paperEmbedded power insert enabling dual-side cooling of microprocessors
- Thomas Brunschwiler
- Dominic Gschwend
- et al.
- 2015
- ECTC 2015
Conference paperElectromigration and thermal migration in Pb-free interconnects
- Minhua Lu
- Thomas Wassick
- et al.
- 2015
- ECTC 2015
Conference paperThrough silicon via process for effective multi-wafer integration
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2015
- ECTC 2015
Conference paperSilicon photonics packaging for highly scalable optical interconnects
- Antonio La Porta
- Jonas Weiss
- et al.
- 2015
- ECTC 2015
Conference paperInfluence of UBM metallurgy on Sn textures and em failure
- Minhua Lu
- Hongqing Zhang
- 2015
- ECTC 2015
Conference paper