An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
- Katsuyuki Sakuma
- Krishna Tunga
- et al.
- 2015
- ECTC 2015
Conference paper
Publications
Organic Multi-Chip Module for high performance systems
- Lei Shan
- Young Kwark
- et al.
- 2015
- ECTC 2015
Conference paperPlanarity-tolerant fine-pitch reworkable interconnections with sharp protrusions and microbumps
- Y. Liu
- Steven L. Wright
- et al.
- 2015
- ECTC 2015
Conference paperNovel mass reflow method for organic substrates
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2015
- ECTC 2015
Conference paperLarge-scale log-determinant computation through stochastic Chebyshev expansions
- Insu Han
- Dmitry Malioutov
- et al.
- 2015
- ICML 2015
Conference paperDeep learning with limited numerical precision
- Suyog Gupta
- Ankur Agrawal
- et al.
- 2015
- ICML 2015
Conference paperCommunity detection using time-dependent personalized PageRank
- Haim Avron
- Lior Horesh
- 2015
- ICML 2015
Conference paperRobust partially observable Markov decision process
- 2015
- ICML 2015
Conference paperQuantitative comparison of hardware transactional memory for Blue Gene/Q, zEnterprise EC12, Intel Core, and POWER8
- Takuya Nakaike
- Rei Odaira
- et al.
- 2015
- ISCA 2015
Conference paperThe push/pull model of transactions
- Eric Koskinen
- Matthew Parkinson
- 2015
- PLDI 2015
Conference paper