Publications

67 results for Chiplets

AI chiplets in an open ecosystem: barriers and solution approaches
- - Daniel Friedman
- 2024
- DAC 2024
Workshop paper
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- - Alberto Valdes Garcia
- 2024
- IMS 2024
Workshop paper
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- - Sari Zerey
  - Junghyun Cho
  - et al.
- 2024
- ECTC 2024
Conference paper
Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- - Minhua Lu
  - Evan Colgan
- 2024
- ECTC 2024
Conference paper
Effect of Micro-channel Cross-section and Coolant Pressure on Two-Phase Cooling
- - Pritish Parida
- 2024
- ITherm 2024
Conference paper
Reduced Physics Modeling of Two-Phase Flow through High-Density Cooling Structures
- - Pritish Parida
  - Shurong Tian
  - et al.
- 2024
- ITherm 2024
Conference paper
Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- - Frank Libsch
  - Steve Bedell
  - et al.
- 2024
- ECTC 2024
Conference paper
Systems Two-Phase Cooling
- - Pritish Parida
  - Timothy Chainer
  - et al.
- 2024
- ARPA-E Summit 2024
Poster
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- - Divya Taneja
  - Katherine Pilger
  - et al.
- 2024
- DPC 2024
Conference paper
Design of Analog-AI Hardware Accelerators for Transformer-based Language Models (Invited)
- - Geoffrey Burr
  - Sidney Tsai
  - et al.
- 2023
- IEDM 2023
Invited talk