High resolution patterning of positive resist for semi-additive process
- Elizabeth A. Duch
- Minhua Lu
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paper
Publications
74 results for Chiplets
Multi-reticle stitching: Applications from packaging to High-NA EUV
- Chris Bottoms
- Rick Johnson
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperSimulation Analysis of Organic-Substrate-Embedded-Thermal-Solution in A Flip-Chip Package Called Power Insert
- Keiji Matsumoto
- Daisuke Oshima
- et al.
- 2025
- MATE 2025
Conference paperD2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Invited talkA 40 GS/s 8b-DAC SST-TX in 7 nm FinFET CMOS for cryogenic quantum applications with 32kB SRAMbased RF-DDS AWG
- Marcel Kossel
- Matthias Brandli
- et al.
- 2024
- ESSERC 2024
Conference paperA NRZ/PAM4 SST TX in 5nm FinFET CMOS with 3-tap FFE and 0.7pJ/b efficiency at 100 Gb/s PAM4
- Marcel Kossel
- Matthias Brandli
- et al.
- 2024
- ESSERC 2024
Conference paperInfusing AI/ML into Chip Design on Hybrid Clouds for Future SoC Development
- Gi-Joon Nam
- 2024
- EPS 2024
Invited talkAI chiplets in an open ecosystem: barriers and solution approaches
- Daniel Friedman
- 2024
- DAC 2024
Workshop paperA Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Alberto Valdes Garcia
- 2024
- IMS 2024
Workshop paperElectromigration Kinetics of SAC/SnBiAg Hybrid Solder
- Minhua Lu
- Evan Colgan
- 2024
- ECTC 2024
Conference paper