Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
Review
Publications
14 results at ASME Journal of Electronic Packaging
Embedded two-phase cooling of large three-dimensional compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2016
- ASME Journal of Electronic Packaging
PaperLid-integral cold-plate topology: Integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2016
- ASME Journal of Electronic Packaging
PaperBenchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2016
- ASME Journal of Electronic Packaging
PaperModeling of two-phase evaporative heat transfer in three-dimensional multicavity high performance microprocessor chip stacks
- Yassir Madhour
- Brian P. D'Entremont
- et al.
- 2014
- ASME Journal of Electronic Packaging
PaperMultiple fan-heat sink cooling system with enhanced evaporator base: Design, modeling, and experiment
- Pablo D. Quinones
- Lawrence S. Mok
- 2009
- ASME Journal of Electronic Packaging
PaperA graphite foams based vapor chamber for chip heat spreading
- Minhua Lu
- Larry Mok
- et al.
- 2005
- ASME Journal of Electronic Packaging
PaperA global sensitivity approach for the dynamic response of printed wiring boards
- H. Jensen
- A.O. Cifuentes
- 1995
- ASME Journal of Electronic Packaging
PaperSome modeling issues on the finite element computation of thermal stresses in metal lines
- Arturo O. Cifuentes
- Iqbal A. Shareef
- 1993
- ASME Journal of Electronic Packaging
PaperModeling thermal stresses in periodic structures: Some obserwations regarding the boundary conditions
- A.O. Cifuentes
- S. Stiffler
- 1992
- ASME Journal of Electronic Packaging
Paper