Xin Zhang

Xin Zhang joined IBM in 2014. He is a Member of Technical Staff & Technical Lead at IBM T. J. Watson Research Center, Yorktown Heights, NY, where he works on power management, power delivery and packaging for high performance computing system, superconducting quantum processors, and AI/ML for EDA.

His research interests include analog circuits, power management circuits, DC-DC converters, power devices, magnetics, machine learning hardware/accelerators, computer system architecture, server system packaging/power delivery/cooling, and AI/ML-assisted EDA. He served as a Guest Editor for IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) and IEEE Solid State Circuits Letters (SSC-L). He is an Associate Editor for IEEE Solid State Circuits Letters. He has served as a Technical Program Committee member for a number of prestigious conferences including: the Applied Power Electronics Conference (APEC), the IEEE VLSI Symposium on Technology and Circuits, the IEEE Custom Integrated Circuits Conference (CICC), the IEEE International Solid-State Circuits Conference (ISSCC) and the Design Automation Conference (DAC). He is an Organizing Committee member for the IBM IEEE CAS/EDS – AI Compute Symposium since 2019. He is also serving as a Technical Advisory Board member in the Analog-Mixed Signal Circuits, Systems, and Devices (AMS-CSD), Semiconductor Research Corporation (SRC). He is selected as a Master Inventor of IBM in 2023. He is a Senior Member of IEEE.