Fully Encapsulated Fine Pitch Dual Damascene Organic RDL With Low Dk Df Photosensitive Polyimide and its Reliability
- Minhua Lu
- Joyce Liu
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
67 results for Chiplets
Experimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
- Amogh Wasti
- Zongmin Yang
- et al.
- 2025
- ITherm 2025
Conference paperFast and Accurate Machine Learning Prediction of Back-End-of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- Prabudhya Roy Chowdhury
- Aakrati Jain
- et al.
- 2025
- ECTC 2025
Conference paperMulti-reticle stitching: Applications from packaging to High-NA EUV
- Chris Bottoms
- Rick Johnson
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperAFM Assisted Hybrid Bonding Interface Optimization
- Nick Polomoff
- Jennifer Fullam
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperHigh resolution patterning of positive resist for semi-additive process
- Elizabeth A. Duch
- Minhua Lu
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperSimulation Analysis of Organic-Substrate-Embedded-Thermal-Solution in A Flip-Chip Package Called Power Insert
- Keiji Matsumoto
- Daisuke Oshima
- et al.
- 2025
- MATE 2025
Conference paperD2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Invited talkA NRZ/PAM4 SST TX in 5nm FinFET CMOS with 3-tap FFE and 0.7pJ/b efficiency at 100 Gb/s PAM4
- Marcel Kossel
- Matthias Brandli
- et al.
- 2024
- ESSERC 2024
Conference paperA 40 GS/s 8b-DAC SST-TX in 7 nm FinFET CMOS for cryogenic quantum applications with 32kB SRAMbased RF-DDS AWG
- Marcel Kossel
- Matthias Brandli
- et al.
- 2024
- ESSERC 2024
Conference paper